CAMERA MODULE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: AOYAMA KATSUMI, KAMIKAWA SHINKO
• Format: Patent
• Language: English
• Published: 08.04.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PHYSICS; PICTORIAL COMMUNICATION, e.g. TELEVISION; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a camera module for suppressing the number of manufacturing steps and improving a yield. SOLUTION: A method of manufacturing a camera module includes: a step of forming an adhesive body consisting of a translucent optical wafer having an array of lenses, which are fixed to a semiconductor wafer having an array of sensors each of which includes a light receiving part of a photoelectric converting element via a spacer part around each sensor, and which are respectively opposed to the sensors via space; and a step of cutting the adhesive body at the spacer part to separate it into camera modules each of which consists of a sensor chip and a lens chip joined by a spacer. Further, the method includes: a step of forming a fixing part which is higher than a top of a convex of the lens around the lens of the translucent optical wafer opposed to the spacer part; and a step of supporting the adhesive body via the fixing part, polishing the semiconductor wafer, and defining a back surface. COPYRIGHT: (C)2010,JPO&INPIT