RESIN ENCAPSULATING MOLD

PROBLEM TO BE SOLVED: To provide a resin encapsulating mold which can be simplified in operations and shortened in heating temperature stabilizing time. SOLUTION: This mold is for pouring a molten thermosetting resin into the cavities formed in an upper and lower molds holding a substrate therebetwe...

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Bibliographic Details
Main Author TAKAMURA KEIJI
Format Patent
LanguageEnglish
Published 02.04.2010
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:PROBLEM TO BE SOLVED: To provide a resin encapsulating mold which can be simplified in operations and shortened in heating temperature stabilizing time. SOLUTION: This mold is for pouring a molten thermosetting resin into the cavities formed in an upper and lower molds holding a substrate therebetween to be cured, where the cavities are each made into a cassette style independently from a pod part for melting the thermosetting resin. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080239895