SILICON RECOVERY METHOD AND DEVICE

• Main Authors: GODA SHOICHI, HAGINO TAKAO, ISHIDA KENICHI, SUZUKI TOSHIHIRO
• Format: Patent
• Language: English
• Published: 02.04.2010
• Subjects: CHEMISTRY; COMPOUNDS THEREOF; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; INORGANIC CHEMISTRY; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLIDMATERIALS OR FLUIDS; METALLURGY; NON-METALLIC ELEMENTS; PERFORMING OPERATIONS; POLISHING; SEPARATING SOLID MATERIALS USING LIQUIDS OR USING PNEUMATICTABLES OR JIGS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS; SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATICTABLES OR JIGS; TRANSPORTING; TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

PROBLEM TO BE SOLVED: To provide silicon recovery method and device capable of stably performing dehydrating treatment without a chemical dose and recovering silicon in high enrichment. SOLUTION: Grinding or polishing drainage including silicon particle groups having two or more peaks in the particle size distribution of silicon particles is divided into two of concentrated liquid (liquid cyclone bottom liquid W3) including the silicon particle groups having peaks of large particle sizes and dilute liquid (liquid cyclone top liquid W2) including silicon particle groups having peaks of small particle sizes by a wet classifier such as a liquid cyclone 13. The concentrated liquid is dehydrated with a dehydrating and drying machine 17 to recover silicon particles at high concentration. COPYRIGHT: (C)2010,JPO&INPIT