PRINTED WIRING BOARD
PROBLEM TO BE SOLVED: To deal with low voltage and also large electric current even in a printed wiring board with edge terminals by increasing an electric current capacity in the edge terminals of the printed wiring board. SOLUTION: The printed wiring board configured by laminating two or more cond...
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Main Author | |
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Format | Patent |
Language | English |
Published |
25.03.2010
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To deal with low voltage and also large electric current even in a printed wiring board with edge terminals by increasing an electric current capacity in the edge terminals of the printed wiring board. SOLUTION: The printed wiring board configured by laminating two or more conductive layers and an insulating layer includes: the edge terminals arranged in the peripheral edge of the printed wiring board and protruded from the peripheral outer shape; a conductive pattern 5 formed of an external layer between the conductive layers; an edge terminal region 7A, which is the extension of the conductive pattern 5 and gold-plated on the most external surface, in the protruded region of each edge terminal; and a through-hole 9 formed in each edge terminal region 7A so as to connect the layer of the edge terminal region 7A to the other layer. COPYRIGHT: (C)2010,JPO&INPIT |
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Bibliography: | Application Number: JP20080230631 |