PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To deal with low voltage and also large electric current even in a printed wiring board with edge terminals by increasing an electric current capacity in the edge terminals of the printed wiring board. SOLUTION: The printed wiring board configured by laminating two or more cond...

Full description

Saved in:
Bibliographic Details
Main Author ARAKI TOSHIO
Format Patent
LanguageEnglish
Published 25.03.2010
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To deal with low voltage and also large electric current even in a printed wiring board with edge terminals by increasing an electric current capacity in the edge terminals of the printed wiring board. SOLUTION: The printed wiring board configured by laminating two or more conductive layers and an insulating layer includes: the edge terminals arranged in the peripheral edge of the printed wiring board and protruded from the peripheral outer shape; a conductive pattern 5 formed of an external layer between the conductive layers; an edge terminal region 7A, which is the extension of the conductive pattern 5 and gold-plated on the most external surface, in the protruded region of each edge terminal; and a through-hole 9 formed in each edge terminal region 7A so as to connect the layer of the edge terminal region 7A to the other layer. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080230631