HOUSING FOR ELECTRONIC DEVICE ENCLOSURE AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a housing for electronic device enclosure in which a surface protective film having properties incompatible with each other, that is, high surface hardness and high self-repairing property and capable of imparting high corrosion resistance and designability to a hous...

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Bibliographic Details
Main Authors NISHIMURA SHIGEFUMI, OTA TOMOAKI, SEKI TOMOYUKI
Format Patent
LanguageEnglish
Published 25.03.2010
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Summary:PROBLEM TO BE SOLVED: To provide a housing for electronic device enclosure in which a surface protective film having properties incompatible with each other, that is, high surface hardness and high self-repairing property and capable of imparting high corrosion resistance and designability to a housing body for electronic device enclosure is formed on at least an outer peripheral face of a housing body for electronic device enclosure. SOLUTION: Such a surface protective film is formed by electrodeposition coating on at least an outer peripheral face of a housing body for electronic device enclosure, using an aqueous electrodeposition coating composition containing an ultraviolet-curing (meth)acrylic resin and a polyfunctional (meth)acrylate compound as protective film forming components. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080233959