METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT APPARATUS

PROBLEM TO BE SOLVED: To provide a means that prevents a needle position from drastically varying with elapsed time even when a wafer chuck as a heat source separates from a probe card in a wafer test in which the probe card is heated to a card temperature corresponding to a test temperature, by loc...

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Bibliographic Details
Main Author YASUMURA BUNJI
Format Patent
LanguageEnglish
Published 18.03.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a means that prevents a needle position from drastically varying with elapsed time even when a wafer chuck as a heat source separates from a probe card in a wafer test in which the probe card is heated to a card temperature corresponding to a test temperature, by locating a wafer stage as a heat source immediately under the probe card together with a tested wafer. SOLUTION: In a probe test in which a probe card is preheated, when a wafer stage as a heating source moves to a position different from a predetermined heating position and does not return in a relatively long time, whether or not the stay is indispensable for the inspection is determined. If the stay is not indispensable, the wafer stage is returned to a waiting position immediately under the probe card. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080224444