METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

• Main Authors: NOZAKI HIDEKI, KOBAYASHI MOTOOMI
• Format: Patent
• Language: English
• Published: 04.03.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, capable of dividing a semiconductor wafer with a spot facing into chips certainly. SOLUTION: The method has a step of preparing the semiconductor wafer 10, in which a plurality of semiconductor elements 11 are formed...