METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, capable of dividing a semiconductor wafer with a spot facing into chips certainly. SOLUTION: The method has a step of preparing the semiconductor wafer 10, in which a plurality of semiconductor elements 11 are formed...

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Bibliographic Details
Main Authors NOZAKI HIDEKI, KOBAYASHI MOTOOMI
Format Patent
LanguageEnglish
Published 04.03.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, capable of dividing a semiconductor wafer with a spot facing into chips certainly. SOLUTION: The method has a step of preparing the semiconductor wafer 10, in which a plurality of semiconductor elements 11 are formed on a first surface 10a, and a spot facing part 12 and a rim 13 enclosing the spot facing part 12 are formed on a second surface 10b opposite to the first surface 10a, a step of sticking a tape 15 on one surface of the first and second surfaces 10a, 10b of the semiconductor wafer 10, and a step of irradiating laser to the spot facing part 12 along a dicing line 20 from the other surface side of the first and second surfaces 10a, 10b, and cutting the semiconductor wafer 10 within the spot facing part 12 to divide it into the chips. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080215850