METHOD OF MANUFACTURING CIRCUIT BOARD

• Main Authors: MATSUMURA YASUSHI, ENOMOTO YASUSHI
• Format: Patent
• Language: English
• Published: 25.02.2010
• Subjects: APPARATUS THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To efficiently manufacture a circuit board configured such that a pattern shape of a mold is precisely transferred and adhesion between a conductor layer and a resin layer is superior. SOLUTION: A polyamide acid solution containing metal ions is applied to the mold having an uneven pattern and is dried to form a polyamide acid layer, which in turn is released from the mold to obtain a polyamide acid film having an uneven surface. The metal ions in the polyamide acid film are reduced to form a metal deposit layer on a surface of the uneven surface. After a conductor layer is formed on the metal deposit layer through electroless plating and/or electroplating, the conductor layer and metal deposit layer are ground until the polyamide acid film is partially exposed to form a patterned conductor layer. Polyamide acid of the polyamide acid film is imidized through a heat treatment to form a polyimide resin layer. COPYRIGHT: (C)2010,JPO&INPIT