SPUTTERING APPARATUS, AND METHOD FOR SPUTTERING MATERIAL FROM TARGET ONTO SUBSTRATE VIA SPUTTERING APPARATUS

• Main Authors: HARTSOUGH LARRY D, MCLEOD PAUL STEPHEN
• Format: Patent
• Language: English
• Published: 12.02.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a sputtering apparatus and a method for sputtering a material from a target onto a substrate via the sputtering apparatus, which achieve high target utilization and more even distribution of the region of the target utilized for deposition on the substrate. SOLUTION: The sputtering apparatus 1 includes a sputtering target 2 with a glow discharge plasma formed thereon during sputtering. The sputtering target is disposed in a plane, with a front of the plane 6 defined as the side on which the glow discharge plasma is located during sputtering and a back of the plane defined as the opposite side. The sputtering apparatus also includes a magnetic circuit with an electrically floating center pole 18 and an electrically floating outside pole 20. Both the center pole and outside pole are at least partially disposed on the front side of the plane defined by the sputtering target. COPYRIGHT: (C)2010,JPO&INPIT