MANUFACTURING METHOD OF PRINTED WIRING BOARD

• Main Authors: ONO HIROKI, SHOJI YOHEI
• Format: Patent
• Language: English
• Published: 04.02.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board wherein a conductive portion is not broken easily and the conductive property of the conductive portion is excellent in forming the conductive portion having a predetermined shape on the board by using a polymer type conductive ink. SOLUTION: The manufacturing method of a printed wiring board provides for a printed wiring board having a board and a conductive portion provided on its one side surface. The manufacturing method has a process A for forming a coated film as the conductive portion by coating the one surface with a polymer type conductive ink and a process B for impressing an electric field between the other surface of the board and the outermost surface of the coated film, and moving conductive microparticles included in the coated film to the outermost surface side of the coated film. COPYRIGHT: (C)2010,JPO&INPIT