COPPER PARTICULATE DISPERSION AND PRODUCTION METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a copper particulate dispersion which has less possibility of being contaminated by impurities of inorganic components and has been produced with a safe method, and to provide a production method therefor. SOLUTION: The copper particulate dispersion containing a hydr...

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Bibliographic Details
Main Author YANASE MANABU
Format Patent
LanguageEnglish
Published 04.02.2010
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CASTING
CHEMISTRY
CONDUCTORS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POWDER METALLURGY
PREPARATION OF CARBON BLACK
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TRANSPORTING
TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES
WORKING METALLIC POWDER
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Summary:PROBLEM TO BE SOLVED: To provide a copper particulate dispersion which has less possibility of being contaminated by impurities of inorganic components and has been produced with a safe method, and to provide a production method therefor. SOLUTION: The copper particulate dispersion containing a hydrazine derivative and copper particulates is produced with a method comprising the steps of: (a) mixing a precursor of the copper particulates with the hydrazine derivative; and (b) adding water to the obtained mixture and heating the resulting mixture to reduce the precursor and deposit the copper particulates. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080190108