POLISHING PAD MANUFACTURING METHOD AND POLISHING PAD

• Main Author: ROBERTS JOHN V H
• Format: Patent
• Language: English
• Published: 28.01.2010
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a pad which is useful in in-situ detection of an end point by using an optical method, and also useful in polishing a wafer on which an integrated circuit is mounted. SOLUTION: The pad is useful in polishing the wafer on which the integrated circuit is mounted, and has a first portion and a second portion. The first portion is made of a hard homogeneous resin sheet which has not intrinsic ability of absorption and transportation of slurry particles and allows light beams having a wavelength in the range of 190 to 3,500 nm to pass therethrough. The second portion is made of an air-injected synthetic urethane structure. COPYRIGHT: (C)2010,JPO&INPIT