POLISHING PAD MANUFACTURING METHOD AND POLISHING PAD

PROBLEM TO BE SOLVED: To provide a pad which is useful in in-situ detection of an end point by using an optical method, and also useful in polishing a wafer on which an integrated circuit is mounted. SOLUTION: The pad is useful in polishing the wafer on which the integrated circuit is mounted, and h...

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Bibliographic Details
Main Author ROBERTS JOHN V H
Format Patent
LanguageEnglish
Published 28.01.2010
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a pad which is useful in in-situ detection of an end point by using an optical method, and also useful in polishing a wafer on which an integrated circuit is mounted. SOLUTION: The pad is useful in polishing the wafer on which the integrated circuit is mounted, and has a first portion and a second portion. The first portion is made of a hard homogeneous resin sheet which has not intrinsic ability of absorption and transportation of slurry particles and allows light beams having a wavelength in the range of 190 to 3,500 nm to pass therethrough. The second portion is made of an air-injected synthetic urethane structure. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090247447