COPPER POWDER FOR CONDUCTIVE PASTE, AND CONDUCTIVE PASTE

PROBLEM TO BE SOLVED: To provide copper powder in which a balance of oxidation resistance and conductivity is not damaged while having fine particle size, and further, to provide copper powder for conductive paste in which the variation of shape and particle size is reduced, and the concentration of...

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Main Authors KURIMOTO TOORU, MIYAKE KOICHI, ODA AKIHIRO, YOSHIMARU KATSUHIKO, UWAZUMI YOSHIAKI
Format Patent
LanguageEnglish
Published 21.01.2010
Subjects
ALLOYS
BASIC ELECTRIC ELEMENTS
CABLES
CASTING
CHEMISTRY
CONDUCTORS
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
INSULATORS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
METALLURGY
PERFORMING OPERATIONS
POWDER METALLURGY
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WORKING METALLIC POWDER
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Summary:PROBLEM TO BE SOLVED: To provide copper powder in which a balance of oxidation resistance and conductivity is not damaged while having fine particle size, and further, to provide copper powder for conductive paste in which the variation of shape and particle size is reduced, and the concentration of oxygen contained therein is low. SOLUTION: The copper powder for conductive paste comprises P (phosphorus) by 0.01 to 0.3 atm% and Ge by 0.1 to 10 atm% at the inside of the particles. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20090134539