LEAD FRAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a lead frame which is sealed with a resin without causing resin burrs when a tape for resin leak prevention is stuck on a mounting surface of the lead frame and one surface of the lead frame is sealed with the resin at a time. SOLUTION: The lead frame 40 is provided...

Full description

Saved in:
Bibliographic Details
Main Author YAMABE NAOKI
Format Patent
LanguageEnglish
Published 14.01.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a lead frame which is sealed with a resin without causing resin burrs when a tape for resin leak prevention is stuck on a mounting surface of the lead frame and one surface of the lead frame is sealed with the resin at a time. SOLUTION: The lead frame 40 is provided with many unit frame portions, each comprising a die pad 12 and leads 14 disposed along sides of the die pad 12, longitudinally and laterally; and a level difference 12a or level differences 14a are formed on at least one of an upper surface of a peripheral edge of the die pad 12 at a wire bonding position and upper surfaces of the leads 14 at wire bonding positions, and further the level differences 12a, 14a are plated (16) with the same uniform thickness as that of a surface of the lead frame 40. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080171682