HEAT TREATMENT EQUIPMENT

PROBLEM TO BE SOLVED: To provide heat treatment equipment capable of uniformly heating a treatment target. SOLUTION: The upper heat treatment equipment 20 and the lower heat treatment equipment 30 are reciprocated together by a half or equivalent distance of a lamp interval D. The surface of the tre...

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Bibliographic Details
Main Author ASAKAWA KEIICHIRO
Format Patent
LanguageEnglish
Published 14.01.2010
Subjects
BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Summary:PROBLEM TO BE SOLVED: To provide heat treatment equipment capable of uniformly heating a treatment target. SOLUTION: The upper heat treatment equipment 20 and the lower heat treatment equipment 30 are reciprocated together by a half or equivalent distance of a lamp interval D. The surface of the treatment target 40 is not opposed to two or more infrared lamps and not greatly separated from the reciprocating infrared lamp, so that the treatment target 40 is heated uniformly. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080168212