FILM THICKNESS MEASURING INSTRUMENT AND FILM THICKNESS MEASURING METHOD

PROBLEM TO BE SOLVED: To provide a film thickness measuring instrument measuring a film thickness with higher accuracy. SOLUTION: A modeling part 721A renews film thicknesses d1of a first layer in order according to a parameter renewing order from a fitting part 722A to renew a function representing...

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Bibliographic Details
Main Authors FUJIMORI MASAYOSHI, SAWAMURA YOSHIMI
Format Patent
LanguageEnglish
Published 07.01.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Summary:PROBLEM TO BE SOLVED: To provide a film thickness measuring instrument measuring a film thickness with higher accuracy. SOLUTION: A modeling part 721A renews film thicknesses d1of a first layer in order according to a parameter renewing order from a fitting part 722A to renew a function representing theoretical reflectivity according to film thicknesses d1after the renewal. Further, the modeling part 721A repeatedly calculates theoretical reflectivity (spectrum) at respective wavelengths according to the renewed function. Under such a procedure, the film thicknesses d1of the first layer are determined by fitting. If the fitting does not converge within a stipulated number of times, the film thicknesses d1of the first layer are determined by using Fourier transformation. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080162046