COMPONENT MOUNTING METHOD AND COMPONENT MOUNTING LINE

• Main Authors: KOSHIO TEPPEI, ISHIKAWA TAKATOSHI
• Format: Patent
• Language: English
• Published: 26.11.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a component mounting method that improves reliability of bonding between a bump and an electrode without lowering the bonding power of a component to a substrate, and to provide a component mounting line. SOLUTION: The component mounting method includes: supplying a thermosetting resin 10 onto the substrate 2 avoiding the electrode 2a on the substrate 2 (a resin supply step (ST2)); and half-curing the thermosetting resin 10 on the substrate 2 by heating the substrate 2 supplied with the thermosetting resin 10 (a resin half-curing step(ST3)). Further, the component mounting method includes: mounting the component on the substrate by bonding the bump 3a to the electrode 2a (a component mounting step (ST5)) while spreading the thermosetting resin 10 half-cured in the step (ST3) with the component 3; and fully curing the thermosetting resin 10 between the substrate 2 and component 3 by heating the substrate 2 mounted with the component 3 (a resin fully curing step (ST6)). COPYRIGHT: (C)2010,JPO&INPIT