STANDARD SUBSTRATE AND INSPECTION METHOD

PROBLEM TO BE SOLVED: To accurately pinpoint the position of a conductive line being an inspection object, in a noncontact type inspection method. SOLUTION: A standard substrate 10 is provided with a support plate 15, and at least one group of conductive lines 30a formed on the support plate. Each c...

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Bibliographic Details
Main Authors SAKA SOTARO, ARATA YUICHI
Format Patent
LanguageEnglish
Published 26.11.2009
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:PROBLEM TO BE SOLVED: To accurately pinpoint the position of a conductive line being an inspection object, in a noncontact type inspection method. SOLUTION: A standard substrate 10 is provided with a support plate 15, and at least one group of conductive lines 30a formed on the support plate. Each conductive line 30 has an electrode line section 31, extending linearly on the support plate, and an extended section 33 connected to an end part of the electrode line section. A plurality of electrode line sections, contained in the one group of conductive lines, are arranged at predetermined intervals. Extended sections contained in the one group of conductive lines are divided into a plurality of groups. Dummy defects 40 are formed, respectively in a pair of extended sections 33c, being in both outermost parts inside each group of extended sections, along a direction parallel to the direction of arrangement of the electrode line sections. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080125497