ADHESIVE SHEET, METHOD FOR PROCESSING ADHEREND USING THE ADHESIVE SHEET, AND ADHESIVE SHEET-PEELING DEVICE

• Main Authors: NISHIO AKINORI, KIUCHI KAZUYUKI
• Format: Patent
• Language: English
• Published: 26.11.2009
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive sheet which can prevent the "warpage" of a weak adherend, after ground, even when the adherend is thinly ground, and can be peeled without breaking or staining the weak adherend, after the finish of back grinding. SOLUTION: Provided is the adhesive sheet 5 obtained by sequentially laminating a substrate layer A, an adhesive agent layer A, a substrate layer B, and an adhesive agent layer B, wherein the substrate layer A: the product of a Young's modulus at 25°C and the thickness of a substrate is 1.0×105to 4.0×105N/m; the product of a Young's modulus at 80°C and the thickness of the substrate is ≤2.8×105N/m; the adhesive agent layer A: a shear modulus is ≤0.2 MPa at 80°C; the substrate B: the product of the Young's modulus and the thickness of the substrate at 25°C is smaller than that of the Young's modulus of the substrate A and the thickness of the substrate at 25°C, and an MD contraction coefficient and a TD contraction coefficient at 80°C are each ≥20%; the adhesive agent layer B: the Young's modulus at 80°C is ≥10 MPa, and an adhesive force to a wafer is ≤0.2 N/10 mm (180°peeling, and a pulling speed of 300 mm/min). COPYRIGHT: (C)2010,JPO&INPIT