EPOXY RESIN, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF

PROBLEM TO BE SOLVED: To provide an epoxy resin for an optical semiconductor encapsulant high in ultraviolet resistance and excellent in heat cycle resistance and adhesion. SOLUTION: Provided are an epoxy resin obtained by reacting one mol of a hydantoin compound represented by formula (1) (wherein...

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Bibliographic Details
Main Authors KATAYAMA NARUTO, UEDA UZUHIKO, UEDA MASATO, ITAI MASAYUKI, NAKAMURA NAOYASU
Format Patent
LanguageEnglish
Published 05.11.2009
Subjects
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PROBLEM TO BE SOLVED: To provide an epoxy resin for an optical semiconductor encapsulant high in ultraviolet resistance and excellent in heat cycle resistance and adhesion. SOLUTION: Provided are an epoxy resin obtained by reacting one mol of a hydantoin compound represented by formula (1) (wherein R1and R2are each a hydrogen atom, a methyl group, or an ethyl group) with 1.1-10 mol of a specified alicyclic epoxy resin, an epoxy resin composition containing the epoxy resin, and an optical semiconductor device containing a cured product thereof. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080106468