FLUX FORMING DEVICE

PROBLEM TO BE SOLVED: To cope with a problem that it is necessary to apply flux with high viscosity by lowering the viscosity when the flux is applied on an electrode formed on a substrate. SOLUTION: This flux forming device is provided with a reservoir tank which accumulates the flux to be supplied...

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Bibliographic Details
Main Authors TOKUYASU YOSHIAKI, NAKAMURA HIDEO, WATASE NAOKI, ABE ISAO, MUKAI NORIAKI
Format Patent
LanguageEnglish
Published 29.10.2009
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To cope with a problem that it is necessary to apply flux with high viscosity by lowering the viscosity when the flux is applied on an electrode formed on a substrate. SOLUTION: This flux forming device is provided with a reservoir tank which accumulates the flux to be supplied to an ink jet head, the ink jet head and a piping part which connects both are provided with heating mechanisms, the flux is discharged on the substrate by lowering the viscosity of the flux by raising temperature, and a table is provided with a cooling mechanism which rapidly cools the substrate so that the flux discharged on the substrate does not flow out. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080100400