METHOD OF MANUFACTURING WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which a cavity having a plurality of connection pad portions arranged in a staircase pattern on a side is easily formed without any trouble. SOLUTION: The method of manufacturing the wiring board includes the processes of:...

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Bibliographic Details
Main Author KUSAMA YASUHIKO
Format Patent
LanguageEnglish
Published 29.10.2009
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which a cavity having a plurality of connection pad portions arranged in a staircase pattern on a side is easily formed without any trouble. SOLUTION: The method of manufacturing the wiring board includes the processes of: forming a multilayer wiring layer having the connection pads P1, P2, P3 disposed on a substrate 10 while shifting in position more outward toward an upper-layer side; forming a mask 40 provided with an opening portion 40a whose side face is in a staircase pattern on the multilayer wiring layer; and forming the cavity C having the plurality of connection pads P1, P2, P3 disposed in the staircase pattern on the side by exposing the connection pads P1, P2, P3 of the multilayer wiring layer by processing insulating layers 34, 32, 30 together at a time through the opening portion 40a of the mask 40 by an anisotropic processing means (wet blast). COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080094791