METHOD OF MANUFACTURING CONDUCTIVE PARTICULATE, CONDUCTIVE PARTICULATE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE

PROBLEM TO BE SOLVED: To provide: a method of manufacturing conductive particulates, which can efficiently manufacture conductive particulates with a CV value and an aspect ratio to be small and without generating contact failure by heating compression at the time of connecting circuits; conductive...

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Bibliographic Details
Main Authors YAMADA YASUYUKI, ANADA MASAHIDE
Format Patent
LanguageEnglish
Published 22.10.2009
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CONDUCTORS
CURRENT COLLECTORS
ELECTRICITY
INSULATORS
LINE CONNECTORS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:PROBLEM TO BE SOLVED: To provide: a method of manufacturing conductive particulates, which can efficiently manufacture conductive particulates with a CV value and an aspect ratio to be small and without generating contact failure by heating compression at the time of connecting circuits; conductive particulates made by using the manufacturing method of the conductive particulates; an anisotropic conductive material made of the conductive particulates; and a conductive connection structure. SOLUTION: The method of manufacturing the conductive particulates with a conductive metal layer formed on the surface of base material particulates includes a base material particulate manufacturing process which comprises: a step of adjusting polyamic acid mixed solution by mixing polyamic acid, metal alkoxide and non-polymerizable organic solvent; an emulsification step of mixing and agitating the polyamic acid mixed solution and emulsifier solution; and a heating step of heating the mixed solution after the emulsification process. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080092999