METHOD FOR JOINING BRIDGE

PROBLEM TO BE SOLVED: To provide a method for joining a viaduct having a high waterproof performance and can flexibly correspond to an enlargement and reduction of a space part in accordance with expansion and contraction of the viaduct by temperature difference and a waterproofing layer is not easi...

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Main Authors KONISHI YASUTO, KUNISADA TATSUO, YOSHIDA TORU, KAWAMURA TSUTOMU, FUJIBAYASHI MASAO, WATANABE KAZUNARI, EDAMATSU MASAYUKI
Format Patent
LanguageEnglish
Published 15.10.2009
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Summary:PROBLEM TO BE SOLVED: To provide a method for joining a viaduct having a high waterproof performance and can flexibly correspond to an enlargement and reduction of a space part in accordance with expansion and contraction of the viaduct by temperature difference and a waterproofing layer is not easily deteriorated by protecting the waterproofing layer from damage factor. SOLUTION: A buffer member 25 is arranged inside of a space part 3 formed between a bridge 1 and 1' adjacent to each other, a waterproofing layer 36 having flexibility by spraying elastomer is formed so as to cover a whole of the top face of the buffer member 25 and at least one part of the top face of the bridge adjacent along the space part, and a protective layer 40 is formed so as to cover the waterproofing layer 36 and at least one part of the top face of the bridge 1 and 1' adjacent along both sides of the waterproofing layer 36. COPYRIGHT: (C)2010,JPO&INPIT
Bibliography:Application Number: JP20080085163