METHOD FOR MANUFACTURING PHOTOMASK AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a photomask, by which dimensional accuracy on a final pattern after multiple exposure processes can be improved, and to provide a method for manufacturing a semiconductor device. SOLUTION: The method for manufacturing the photomask comprise...

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Bibliographic Details
Main Author SAITO MASATO
Format Patent
LanguageEnglish
Published 24.09.2009
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a method for manufacturing a photomask, by which dimensional accuracy on a final pattern after multiple exposure processes can be improved, and to provide a method for manufacturing a semiconductor device. SOLUTION: The method for manufacturing the photomask comprises: producing a first photomask of first and second photomasks used for forming a pattern, by drawing a first mask pattern based on the design data corresponding the photomask; measuring a positional error of the first mask pattern in the first photomask; calculating a systematic positional error from the positional error of the first mask pattern; and producing the second photomask by drawing a second mask pattern based on a coordinate system that reflects the systematic positional error, based on the design data corresponding to the second photomask. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080061063