SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: TEJIMA TAKANORI, NORITAKE CHIKAGE, MASAMITSU KUNIAKI
• Format: Patent
• Language: English
• Published: 17.09.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor module which is easily incorporated in a cooler etc., has superior heat dissipation property, and is easy to manufacture, and to provide a method of manufacturing the same. SOLUTION: The semiconductor module 1 is constituted by integrally molding, wit...