SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

• Main Authors: TEJIMA TAKANORI, NORITAKE CHIKAGE, MASAMITSU KUNIAKI
• Format: Patent
• Language: English
• Published: 17.09.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor module which is easily incorporated in a cooler etc., has superior heat dissipation property, and is easy to manufacture, and to provide a method of manufacturing the same. SOLUTION: The semiconductor module 1 is constituted by integrally molding, with a molding resin 11, a semiconductor element 2 and a pair of heat dissipation plates 3 which are disposed in thermal contact with both principal surfaces of the semiconductor element 2 and electrically connected to electrodes of the semiconductor element 2. On external-side surfaces 31 of the pair of heat dissipation plates 3, insulators 4 are formed directly. On external-side surfaces 41 of the insulators 4, metal bodies 5 are formed directly which have end edges 52 disposed inside end edges 42 of the insulators 4. The insulators 4 are covered with the metal bodies 5 and molding resin 11. The metal bodies 5 are exposed outside from the molding resin 11. COPYRIGHT: (C)2009,JPO&INPIT