POLISHING APPARATUS

PROBLEM TO BE SOLVED: To provide a polishing apparatus that can polish a periphery on one side of a substrate while keeping an original face angle of the substrate. SOLUTION: This substrate equipment comprises: a substrate holding mechanism 1 for holding and rotating the substrate W; a polishing mec...

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Bibliographic Details
Main Authors KUSA HIROAKI, MAEDA KAZUAKI, TAKAHASHI YOSHIMIZU, SEKI MASAYA
Format Patent
LanguageEnglish
Published 17.09.2009
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a polishing apparatus that can polish a periphery on one side of a substrate while keeping an original face angle of the substrate. SOLUTION: This substrate equipment comprises: a substrate holding mechanism 1 for holding and rotating the substrate W; a polishing mechanism 2 for polishing the periphery of the substrate W by pressing a polishing tool 10 to the periphery; and a periphery support mechanism 3 for supporting the periphery of the substrate W by fluid. The periphery support mechanism 3 is constituted so that either the substrate face opposite to the substrate periphery or the substrate face on the same side of the substrate periphery is supported. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080055946