ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND METHOD OF CONNECTING CIRCUIT MEMBER USING THE SAME

• Main Author: HIROZAWA YUKIHISA
• Format: Patent
• Language: English
• Published: 27.08.2009
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive film for circuit connection, which is adaptable to high resolution, is excellent in long-term connection reliability, and has excellent workability. SOLUTION: The adhesive film for circuit connection connects a first circuit member in which first circuit electrodes are formed on a main surface of a first substrate and a second circuit member in which second circuit electrodes are formed on a main surface of a second substrate in a condition where the first circuit electrodes and the second circuit electrodes are arranged in a face-to-face configuration, wherein the adhesive film for circuit connection comprises at least an electrically conductive adhesive layer containing electrically-conductive grains and an adhesive, a first insulating adhesive layer formed on a surface of the electrically conductive adhesive layer, and a second insulating adhesive layer formed on a surface opposite to the one on which the first insulating adhesive layer is formed of the electrically conductive adhesive layer, wherein the thickness of the electrically conductive adhesive layer is two times or less of the average grain diameter of the electrically conductive grains, and the storage modulus of the electrically conductive adhesive layer at 40°C is 0.1 to 1.5 GPa. A connection structure of the circuit members and a method of connecting the circuit members using the adhesive film for circuit connection are also disclosed. COPYRIGHT: (C)2009,JPO&INPIT