WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a wiring substrate having a high-density fine wiring that is a very thin type and is superior in electrical insulation reliability. SOLUTION: The wiring substrate including a laminate 4, constituted of a first wiring conductor 1, consisting of a plating conductor dep...

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Bibliographic Details
Main Authors OSUMI KOICHI, YAMADA HIROICHI
Format Patent
LanguageEnglish
Published 27.08.2009
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a wiring substrate having a high-density fine wiring that is a very thin type and is superior in electrical insulation reliability. SOLUTION: The wiring substrate including a laminate 4, constituted of a first wiring conductor 1, consisting of a plating conductor deposited in a predetermined pattern; an insulated base material 2 that is composed of a fiber reinforced resin sheet in which the conductor 1 is embedded in one principal plane and has a via hole 5, leading to the conductor 1 from another principal plane; and a second wiring conductor 3, attached so as to be electrically connected to the conductor 1 constituted of the plating conductor deposited, in a predetermined pattern on another principal plane of the material 2 and inside the via hole 5 is provided. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080036129