SEMICONDUCTOR DEVICE AND INTERPOSER SUBSTRATE

PROBLEM TO BE SOLVED: To provide a semiconductor device eliminating the need for using an expensive stress-relaxation elastomer and an interposer substrate used for the semiconductor device. SOLUTION: A BGA type semiconductor device 10 is interposed between a semiconductor element 4 and the interpos...

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Bibliographic Details
Main Authors HOSONO MASAYUKI, SHIBATA AKIJI
Format Patent
LanguageEnglish
Published 13.08.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device eliminating the need for using an expensive stress-relaxation elastomer and an interposer substrate used for the semiconductor device. SOLUTION: A BGA type semiconductor device 10 is interposed between a semiconductor element 4 and the interposer substrate 3. The semiconductor device 10 has a connecting layer 5 being composed of the quality of the material generating a breakdown, a slippage or a peeling when a stress works or having a structure generating the breakdown, the slippage or the peeling. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080017331