WINDING TYPE VAPOR DEPOSITION APPARATUS AND WINDING TYPE VAPOR DEPOSITION METHOD, AND BARRIER FILM

• Main Author: ISHII RYOJI
• Format: Patent
• Language: English
• Published: 13.08.2009
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a winding type vapor deposition apparatus which can stably deposit a barrier thin film free from damage on a film substrate caused to run for being wound, to provide a winding type vapor deposition method and to provide a barrier film. SOLUTION: The winding vapor deposition apparatus vapor-deposits an evaporation material heated and evaporated by an electron beam on the film substrate 12 caused to run for being wound thereby forming a gas barrier thin film, wherein the apparatus is provided with a DC power source 26 for plasma generation and applying a positive potential to a film deposition roll 15, the positive potential is applied from the DC power source 26 to the film deposition roll 15, and, after the peeling of the film substrate 12 from the film deposition roll 15 in an unwinding-winding chamber 20, plasma 27 is generated between the film substrate 12 and the film deposition roll 15. COPYRIGHT: (C)2009,JPO&INPIT