COLD SETTING POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR PATTERN CURED FILM AND ELECTRONIC COMPONENT

• Main Authors: OE TADAYUKI, MINEGISHI TOMONORI, NOKITA RIKA
• Format: Patent
• Language: English
• Published: 06.08.2009
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS THEREFOR; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a cold-setting positive photosensitive resin composition having excellent cured film characteristics even at cold cure at 200°C or lower, a production method for a pattern cured film and an electronic component. SOLUTION: The cold-setting positive photosensitive resin composition used for producing a cured film by heat treatment at 280°C or lower contains (a) a polybenzoxazole (PBO) having a branched structure, a polyimide (PI) or a precursor thereof, and (b) a compound to generate an acid by light. The positive photosensitive resin composition may further contain as a (c) component a compound to be cross-linked with the (a) component or self-polymerized by heating. COPYRIGHT: (C)2009,JPO&INPIT