CONDUCTIVE PATTERN FORMATION MATERIAL, CONDUCTIVE PATTERN FORMATION METHOD, AND WIRING BOARD

PROBLEM TO BE SOLVED: To provide a material for forming a low-resistance extra-fine conductive pattern having a dense film condition and small surface roughness; a conductive pattern formation method; and a wiring board. SOLUTION: This conductive pattern formation material comprises a combination of...

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Bibliographic Details
Main Author IMADA YUJI
Format Patent
LanguageEnglish
Published 30.07.2009
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:PROBLEM TO BE SOLVED: To provide a material for forming a low-resistance extra-fine conductive pattern having a dense film condition and small surface roughness; a conductive pattern formation method; and a wiring board. SOLUTION: This conductive pattern formation material comprises a combination of a first material 1 prepared by dispersing and mixing first conductive particles in a mixture of a thermally-degradable polymer material and a solvent, and a second material 2 prepared by dispersing second conductive particles with particle sizes smaller than those of the first conductive particles in a dispersion medium, and in the first material 1, the ratio of the weight of the first conductive particles to that of the thermally-degradable polymer material is 10:1 to 100:1. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080003390