CIRCUIT CONNECTION MATERIAL, FILM-LIKE CIRCUIT CONNECTION MATERIAL USING THIS, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND ITS MANUFACTURING METHOD

• Main Authors: GOTO YASUSHI, FUJII AYA, FUJII MASANORI, HIROZAWA YUKIHISA, TAKETAZU JUN, WATANABE ITSUO
• Format: Patent
• Language: English
• Published: 30.07.2009
• Subjects: BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRICITY; LINE CONNECTORS

PROBLEM TO BE SOLVED: To provide a circuit connection material capable of lowering connection resistance between opposed circuit electrodes, and sufficiently improving an insulating property between circuit electrodes adjacent to each other, a film-like circuit connection material using it, a connec...