CIRCUIT CONNECTION MATERIAL, FILM-LIKE CIRCUIT CONNECTION MATERIAL USING THIS, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND ITS MANUFACTURING METHOD

• Main Authors: GOTO YASUSHI, FUJII AYA, FUJII MASANORI, HIROZAWA YUKIHISA, TAKETAZU JUN, WATANABE ITSUO
• Format: Patent
• Language: English
• Published: 30.07.2009
• Subjects: BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRICITY; LINE CONNECTORS

PROBLEM TO BE SOLVED: To provide a circuit connection material capable of lowering connection resistance between opposed circuit electrodes, and sufficiently improving an insulating property between circuit electrodes adjacent to each other, a film-like circuit connection material using it, a connection structure of circuit members and its manufacturing method. SOLUTION: The connection structure 10 of circuit members is equipped with a circuit member 20 with circuit electrodes 22 formed, and a circuit member 30 with circuit electrodes 32 formed. A circuit connection member 60 for connecting each circuit member 20, 30 with the other so as to have the circuit electrodes 22, 32 face each other is formed of a hardened material of this circuit connection material. The circuit connection material contains an adhesive composition, and coated particles 50 formed by partially coating surfaces 51a of conductive particles 51 with insulating fine particles 52, and a specific gravity of the coated particles 50 is 97/100 to 99/100 of that of the conductive particles 51. The circuit electrodes 22 or the circuit electrodes 32 include bumps each with an area of less than 3,000 μm2. COPYRIGHT: (C)2009,JPO&INPIT