PARTITION DEVICE

PROBLEM TO BE SOLVED: To enhance the degree of freedom of wiring inside a partition device using a frame. SOLUTION: This partition device 1 includes: a frame 2 which has a plurality of rectangular frames formed of a plurality of supports 3 provided almost perpendicularly to a floor surface, and a pl...

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Bibliographic Details
Main Authors KUNISHITA CHO, HOSOI YASUHARU
Format Patent
LanguageEnglish
Published 23.07.2009
Subjects
BUILDING
CEILINGS
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
INSULATION OR OTHER PROTECTION OF BUILDINGS
ROOFS
WALLS, e.g. PARTITIONS
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Summary:PROBLEM TO BE SOLVED: To enhance the degree of freedom of wiring inside a partition device using a frame. SOLUTION: This partition device 1 includes: a frame 2 which has a plurality of rectangular frames formed of a plurality of supports 3 provided almost perpendicularly to a floor surface, and a plurality of horizontal plates 6 and 7 for connecting the plurality of supports 3; and a panel 8 which is installed on the plurality of rectangular frames, formed by the frame 2, from both front and rear surfaces of the rectangular frame. The frame 2 has wiring hole portions 63 and 73 for connecting internal spaces, adjoining each other across the frame 2, among a plurality of internal spaces which enable wiring and which are formed of the plurality of rectangular frames and the panel 8. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070340252