METHOD OF SINGULATING CIRCUIT BOARD AND PACKAGE CIRCUIT BOARD

• Main Author: YOKOUCHI KISHIO
• Format: Patent
• Language: English
• Published: 02.07.2009
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PROBLEM TO BE SOLVED: To provide a method of singulating circuit boards capable of preventing electrical short circuit of the package circuit board without exposing a conductive material from the outer side surfaces of the package circuit when package circuit boards are formed by dicing a circuit board with a core substrate having conductivity, and to provide a package circuit board. SOLUTION: The method of singulating a circuit board includes: a step of forming a circuit board 100 by forming a core portion 10 including a conductive material and providing a wiring layer 20 on the surface of the core portion; a step of forming concave channels 30 in a thickness direction of the circuit board from one surface of the circuit board so as to pass through at least the core portion; a step of forming an insulating cover layer 40 on a surface of the wiring layer and inside the concave channels; and a step of dicing the circuit board within widths of the concave channels with positions of the concave channels as dicing positions. COPYRIGHT: (C)2009,JPO&INPIT