MOTHER BOARD AND METHOD OF FORMING ELECTROLYTIC PLATING FILM

• Main Author: ONIZUKA YOSHITOMO
• Format: Patent
• Language: English
• Published: 25.06.2009
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board capable of forming a plating film uniform in thickness with respect to a pattern to be plated by an electrolytic plating method. SOLUTION: The multiple patterning wiring board includes: the pattern 103 to be plated, which is formed...