MOTHER BOARD AND METHOD OF FORMING ELECTROLYTIC PLATING FILM

PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board capable of forming a plating film uniform in thickness with respect to a pattern to be plated by an electrolytic plating method. SOLUTION: The multiple patterning wiring board includes: the pattern 103 to be plated, which is formed...

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Bibliographic Details
Main Author ONIZUKA YOSHITOMO
Format Patent
LanguageEnglish
Published 25.06.2009
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a multiple patterning wiring board capable of forming a plating film uniform in thickness with respect to a pattern to be plated by an electrolytic plating method. SOLUTION: The multiple patterning wiring board includes: the pattern 103 to be plated, which is formed in a wiring board region 102; a pattern 105 for electrolytic plating, which is formed in a throw-away margin region 104 at a periphery of the wiring board region 102, electrically connected to the pattern 103 to be plated, and exposed at least partially on the surface; and a pattern 109 for inspection provided successively apart from the exposed portion 105a of the pattern 105 for electrolytic plating. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20080017623