WET LAMINATION OF PHOTOPOLYMERIZABLE DRY FILM ONTO SUBSTRATE, AND COMPOSITION RELATED THERETO

• Main Authors: AMARI NARIYUKI, JORGE PEDRO GONCALO CARVALHAIS TEIXEIRA DIAS
• Format: Patent
• Language: English
• Published: 25.06.2009
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a wet lamination system for a dry film photoresist capable of enhancing performance, in particular, as to unfavorable air seal-in and a troublesome surface residue. SOLUTION: This wet lamination system of the present invention uses a lamination solution useful for a process for wet laminating a photopolymerizable film onto a circuit board panel or other substrate, as an object. The lamination system includes (1) the dry film photoresist, (2) a laminate including (i) copper, (ii) stainless steel and (iii) a nonmetallic surface, (3) a lamination liquid, and (4) a device for applying the liquid onto the laminate. The lamination liquid contains water and a surface energy modifier. The surface energy modifier is within a range of 0.0001-3.0 mol/l of concentration, and a pH of the liquid is between 3 and 11. COPYRIGHT: (C)2009,JPO&INPIT