RESIN LAMINATE, TACKY ADHESIVE SHEET, METHOD FOR WORKING ADHEREND USING THE TACKY ADHESIVE SHEET, AND DEVICE FOR SEPARATING THE TACKY ADHESIVE SHEET

• Main Authors: NISHIO AKINORI, KIUCHI KAZUYUKI
• Format: Patent
• Language: English
• Published: 11.06.2009
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; DYES; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a tacky adhesive sheet for semiconductor wafer polishing which can be smoothly separated upon heating from any one direction, and a method for working an adherend bonded to each other with the tacky adhesive sheet, and a device for separating the tacky adhesive sheet. SOLUTION: A tacky adhesive sheet 5 in this invention comprises a resin laminate in which a higher heat shrinkable base material layer 1 with relatively larger heat shrinkage and a lower heat shrinkable base material layer 3 with relatively lower heat shrinkage are bonded through an adhesives layer 2. In the higher heat shrinkable base material layer 1, a ratio (A:B) of a shrinkage [A (%)] in a main shrinkage direction and a shrinkage [B (%)] in a direction orthogonal to the main shrinkage direction is 1:1 to 10:1. Upon heating from any one direction, the resin laminate is warped to the higher heat shrinkable base material layer side, and, upon further heating, the resin laminate is spontaneously wound to one direction from one end to form one cylindrical roll. COPYRIGHT: (C)2009,JPO&INPIT