LED UNIT

PROBLEM TO BE SOLVED: To provide an LED unit that enhances an optical output and has a high reliability for a temperature cycle. SOLUTION: The LED unit A includes: a heat exchanger plate 2; a sub-mount part 3 protruding onto the one surface side of the heat exchanger plate 2; a wiring board 4 which...

Full description

Saved in:
Bibliographic Details
Main Authors URANO YOJI, KUZUHARA KAZUNARI, KAMATA SAKUO
Format Patent
LanguageEnglish
Published 21.05.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide an LED unit that enhances an optical output and has a high reliability for a temperature cycle. SOLUTION: The LED unit A includes: a heat exchanger plate 2; a sub-mount part 3 protruding onto the one surface side of the heat exchanger plate 2; a wiring board 4 which has a window hole 43 with the sub-mount part 3 being disposed separately inwardly, and is disposed on the one surface side of the heat exchanger plate 2; and a surface mounting type LED 1 in which externally connecting electrodes 13, 13 of a package 12 encasing an LED chip 11 are bonded to wiring patterns 42, 42 of the wiring board 4 via first bonding parts 6, 6, and a heat dissipating conductor part 15 provided on the backside of the package 12 is bonded to the sub-mount part 3 via a second bonding part 7. There is a stress buffer part 8 made of a thermoelastic resin which exists between the heat exchanger plate 2 and the wiring board 4 for bonding the both, and buffers a stress working on each of the bonding parts 6, 6, 7 owing to a difference in a coefficient of linear expansion between the heat exchanger plate 2, and each of the wiring board 4 and the package 12. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070282235