POSITIVE PHOTOSENSITIVE COMPOSITION, MANUFACTURING METHOD OF CURED FILM, CURED FILM, AND ELEMENT WHICH HAS CURED FILM

• Main Authors: SUWA MITSUFUMI, KAMOGAWA MASAO, OKAZAWA TORU
• Format: Patent
• Language: English
• Published: 07.05.2009
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

PROBLEM TO BE SOLVED: To provide a positive photosensitive composition having high heat resistance, high transparency performance, and favorable sensitivity even if a low concentration developing liquid is used, and having excellent anti-alkali resistance in a cured film. SOLUTION: The positive photosensitive composition shows an alkyl group selected from (a) polysiloxane, (b) a (meta)acrylic polymer, (c) a quinonediazide compound of a formula (1), in which R1represents a hydrogen atom, or selected from a 1-8C alkyl group. R2, R3and R4represent one of a hydrogen atom selected from the 1-8C alkyl group, an alkoxy group, a carboxyl group, or an ester group. The R2, R3and R4may be the same or different from one another. Q represents either of a 5-naphthoquinone-diazide sulfonyl group or a hydrogen atom, all of Q cannot be hydrogen atoms, and a, b, c, α and β represent integers of 0-4, but α+β≥3, and a (d) positive photosensitive composition containing solvent. COPYRIGHT: (C)2009,JPO&INPIT