HEAT DISSIPATION STRUCTURE OF PORTABLE COMMUNICATION APPARATUS

PROBLEM TO BE SOLVED: To provide the heat dissipation structure of a portable communication apparatus that easily removes an unpleasant feeling during an operation due to a local rise in case surface temperature without greatly increasing a cost of, for example, adding a special heat dissipation str...

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Bibliographic Details
Main Author WATANABE YASUSUKE
Format Patent
LanguageEnglish
Published 30.04.2009
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TELEPHONIC COMMUNICATION
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Summary:PROBLEM TO BE SOLVED: To provide the heat dissipation structure of a portable communication apparatus that easily removes an unpleasant feeling during an operation due to a local rise in case surface temperature without greatly increasing a cost of, for example, adding a special heat dissipation structure to the conventional heat dissipation structure. SOLUTION: A cut hole 5 smaller than the surface size of an electronic component 4 is formed in a graphite sheet 2, and an electronic component surface is brought into contact with the graphite sheet 2 at the periphery of the cut hole 5. Heat conduction to a case 1 is small in the region of the cut hole 5 and heat from the electronic component 4 is easily conducted in peripheral directions thereof so that the heat conduction state in the case is dispersed, thereby preventing a local temperature rise. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070261871