ADHESIVE COMPOSITION

PROBLEM TO BE SOLVED: To provide an adhesive composition having good valance in heat resistance, chemical resistance, adhesiveness to various kinds of adherends, hardness, mechanical properties such as impact resistance, etc., and exhibiting the excellent properties. SOLUTION: The epoxy-acryl hybrid...

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Bibliographic Details
Main Authors KAGEISHI KAZUJI, ONO KOTARO
Format Patent
LanguageEnglish
Published 23.04.2009
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide an adhesive composition having good valance in heat resistance, chemical resistance, adhesiveness to various kinds of adherends, hardness, mechanical properties such as impact resistance, etc., and exhibiting the excellent properties. SOLUTION: The epoxy-acryl hybrid adhesive composition contains an acryloyl group-containing butadiene oligomer represented by specific structural formulas (A) or (B) and having 1,000-5,000 number average molecular weight, an epoxy resin and an acryl monomer. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070259399