END FACE GRINDING METHOD

PROBLEM TO BE SOLVED: To carry out grinding of a thin-workpiece with a small thickness dimension by using an existing device without any problem. SOLUTION: In an end face grinding method, a carrier 35 for holding the workpiece having an opening part 35a interposed between a grinding stone and a surf...

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Bibliographic Details
Main Author OUCHI HISAO
Format Patent
LanguageEnglish
Published 23.04.2009
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To carry out grinding of a thin-workpiece with a small thickness dimension by using an existing device without any problem. SOLUTION: In an end face grinding method, a carrier 35 for holding the workpiece having an opening part 35a interposed between a grinding stone and a surface plate 20, and the workpiece W inserted into the opening part 35a is ground by the grinding stone in a state of being held by the grinding stone and the surface plate 20. In this case, a grinding assist member 40 having a thickness dimension smaller than that of the carrier 35 and larger than dimensional difference between the carrier 35 and the workpiece W in the thickness direction and the workpiece W are mutually connected by magnetic force in a layered state in the thickness direction and inserted into the opening part 35a of the carrier 35 to process a surface to be ground of the workpiece W. COPYRIGHT: (C)2009,JPO&INPIT
Bibliography:Application Number: JP20070259573