FIXING MECHANISM OF PLATE

PROBLEM TO BE SOLVED: To solve a problem that although a heater plate to heat and hold a semiconductor package and to die-bond a semiconductor chip, and a heater block having a heater built-in and capable of heating at an optional temperature are conventionally fastened in the longitudinal direction...

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Main Authors ISHIKURA YOSHIFUMI, KAMAKURA MITSUTOSHI
Format Patent
LanguageEnglish
Published 02.04.2009
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Abstract PROBLEM TO BE SOLVED: To solve a problem that although a heater plate to heat and hold a semiconductor package and to die-bond a semiconductor chip, and a heater block having a heater built-in and capable of heating at an optional temperature are conventionally fastened in the longitudinal direction with a screw, the screw seizes in a hole and the screw cannot be turned and collapses in some cases because the heater plate must be replaced when the kind of a semiconductor element is changed, and because the temperatures of the heater plate and the heater block rise high. SOLUTION: The heater block and the heater plate are fabricated of materials different in thermal expansion coefficient. A protrusion is formed on either of the upper surface of the heater block or the bottom surface of the heater plate and on the member having a higher thermal expansion coefficient; a recess is formed thereon and on the member having a lower thermal expansion coefficient; and if the recess and the protrusion are engaged with a slight gap at ordinary temperature, and heated, the recess and the protrusion expand to exert a compression stress to the engaging part. COPYRIGHT: (C)2009,JPO&INPIT
AbstractList PROBLEM TO BE SOLVED: To solve a problem that although a heater plate to heat and hold a semiconductor package and to die-bond a semiconductor chip, and a heater block having a heater built-in and capable of heating at an optional temperature are conventionally fastened in the longitudinal direction with a screw, the screw seizes in a hole and the screw cannot be turned and collapses in some cases because the heater plate must be replaced when the kind of a semiconductor element is changed, and because the temperatures of the heater plate and the heater block rise high. SOLUTION: The heater block and the heater plate are fabricated of materials different in thermal expansion coefficient. A protrusion is formed on either of the upper surface of the heater block or the bottom surface of the heater plate and on the member having a higher thermal expansion coefficient; a recess is formed thereon and on the member having a lower thermal expansion coefficient; and if the recess and the protrusion are engaged with a slight gap at ordinary temperature, and heated, the recess and the protrusion expand to exert a compression stress to the engaging part. COPYRIGHT: (C)2009,JPO&INPIT
Author KAMAKURA MITSUTOSHI
ISHIKURA YOSHIFUMI
Author_xml – fullname: ISHIKURA YOSHIFUMI
– fullname: KAMAKURA MITSUTOSHI
BookMark eNrjYmDJy89L5WSQdPOM8PRzV_B1dfZw9PMM9lXwd1MI8HEMceVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGBpYG5oZGBkaOxkQpAgAO-CHl
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID JP2009071202A
GroupedDBID EVB
ID FETCH-epo_espacenet_JP2009071202A3
IEDL.DBID EVB
IngestDate Fri Jul 19 11:50:30 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_JP2009071202A3
Notes Application Number: JP20070240368
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090402&DB=EPODOC&CC=JP&NR=2009071202A
ParticipantIDs epo_espacenet_JP2009071202A
PublicationCentury 2000
PublicationDate 20090402
PublicationDateYYYYMMDD 2009-04-02
PublicationDate_xml – month: 04
  year: 2009
  text: 20090402
  day: 02
PublicationDecade 2000
PublicationYear 2009
RelatedCompanies SUMITOMO ELECTRIC IND LTD
RelatedCompanies_xml – name: SUMITOMO ELECTRIC IND LTD
Score 2.7364712
Snippet PROBLEM TO BE SOLVED: To solve a problem that although a heater plate to heat and hold a semiconductor package and to die-bond a semiconductor chip, and a...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title FIXING MECHANISM OF PLATE
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090402&DB=EPODOC&locale=&CC=JP&NR=2009071202A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dS8Mw8JhT1DedyuZUikjfil1b2-ahSJe2tsV-oFX6NtaQgghzuIp_30tddU97Czm4JEcu95W7A7ipuegSx2vFtDhTjJoYClHntmKqRNMYq5hRCYd-kprhixGXd2UP3rtcmLZO6HdbHBE5iiG_N-17vfx3Ynnt38rVbfWGUx_3QeF4cmcdE7yTmuxNHT_PvIzKlDpxLqdPvzBrgqa-uwO7Qo8Whfb916lIS1luypTgCPZyRLdojqHHFwM4oF3rtQHsJ-uINw7XzLc6gVEQlVH6ICU-Dd00ek6kLJDyR7fwT-E68AsaKrjG7O9Eszjf2I9-Bn009fkQJDLhouA6M0ybIN3mxETtyNKZTmqtsjkbwXgLovOt0DEcdpEQVbuAfvP5xS9RoDbVVUuIH41PdRI
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT4MwEL_MaZxvOjWb84MYwxuRAQJ9IIbxISBfUTS8kdGUxJjMxWH89z1w6J721vSSa3vp9fq79u4AbirWVIljlaBqjApKRRSBiHNdUEUiSZSWVCkbh34Uq96LEuR3eQ_eu1iYNk_od5scETWKor7X7Xm9_Hdi2e3fytVt-YZdH_duZth8h44J7kmJt2eGkyZ2YvGWZQQpHz_90rQpQn1zB3Y1xIQtVnqdNWEpy02b4h7CXorsFvUR9NhiCAOrK702hP1o_eKNzbXyrY5h7Pq5Hz9wkWN5Zuw_R1zicmloZs4JXLtOZnkCjlH8ragI0o35yKfQR6jPRsCRKWsSrlNF1QnKbU5UvB1pMpVJJZU6o2OYbGF0tpV6BQMvi8Ii9OPHCRx0ryKidA79-vOLXaBxrcvLVig_K1F3_A
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=FIXING+MECHANISM+OF+PLATE&rft.inventor=ISHIKURA+YOSHIFUMI&rft.inventor=KAMAKURA+MITSUTOSHI&rft.date=2009-04-02&rft.externalDBID=A&rft.externalDocID=JP2009071202A